http://www.wirelessdesignasia.comWireless Design Asia - Materialsen-USCopyright 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.Thu, 18 Mar 2010 11:24:25 +0800http://wirelessdesignasia.com/article-11972-mobilephonedisplaysbenefitfromemergingmarkets-Asia.htmlAfter hitting bottom in Q1’09, mobile display shipments for Q2’09 reached 360 million, up 30% Q/Q and 3% Y/Y. Revenues were up 29% Q/Q to $2.93 billion, but down 5% Y/Y. According to the DisplaySearch, ....http://wirelessdesignasia.com/article-11972-mobilephonedisplaysbenefitfromemergingmarkets-Asia.htmlThu, 26 Nov 2009 00:00:00 +0800http://wirelessdesignasia.com/article-11967-gsmalaunchesgreenmanifestoforthemobileindustry-Asia.htmlAt the Mobile Asia Congress, the GSMA unveiled Mobile's Green Manifesto, developed in collaboration with The Climate Group. Rob Conway, CEO and Member of the Board, GSMA, was joined at the launch by China ....http://wirelessdesignasia.com/article-11967-gsmalaunchesgreenmanifestoforthemobileindustry-Asia.htmlWed, 25 Nov 2009 00:00:00 +0800http://wirelessdesignasia.com/article-11954-fairchildsemiconductorsmicrofetthinpackagetargetsbatterychargingandpowermultiplexingapplications-Asia.htmlFairchild Semiconductor’s MicroFET thin package helps designers avoid compromising their designs by providing them with an industry-leading low profile package. Working with design engineers and procurement ....http://wirelessdesignasia.com/article-11954-fairchildsemiconductorsmicrofetthinpackagetargetsbatterychargingandpowermultiplexingapplications-Asia.htmlTue, 24 Nov 2009 00:00:00 +0800http://wirelessdesignasia.com/article-11822-lairdtechnologiesexpandsemisentryproductportfolio-Asia.htmlLaird Technologies Inc. has announced the addition of three products to its EMI Sentry Form-In-Place gasket family. This top-of-the-line Form-In-Place gasket family provides EMI shielding while offering ....http://wirelessdesignasia.com/article-11822-lairdtechnologiesexpandsemisentryproductportfolio-Asia.htmlTue, 3 Nov 2009 00:00:00 +0800http://wirelessdesignasia.com/article-11779-dualsimholderplatinumminiatureconcentrateoftechnology-Asia.htmlThe Swiss Company Stancom announces the launch of its latest innovation on Dual SIM Holder *, the "Platinum", a true innovative miniature concentrate of technology. The new Platinum V7.0 differs from ....http://wirelessdesignasia.com/article-11779-dualsimholderplatinumminiatureconcentrateoftechnology-Asia.htmlWed, 28 Oct 2009 00:00:00 +0800http://wirelessdesignasia.com/article-11705-terepacandimecjoinforcesinlowcostflexibleelectronicspackaging-Asia.htmlTerepac Corporation, an emerging leader in electronics miniaturization, packaging and assembly, and IMEC, a leading European research center in nanotechnology, announce their collaboration on novel packaging ....http://wirelessdesignasia.com/article-11705-terepacandimecjoinforcesinlowcostflexibleelectronicspackaging-Asia.htmlWed, 21 Oct 2009 00:00:00 +0800http://wirelessdesignasia.com/article-11032-stantumandsitronixteamtomeetdemandforcosteffectivehighperformancemultitouchinconsumerandmobileapplic-Asia.htmlStantum, a pioneer developer of multi-touch technology, and Sitronix, a developer of LCD driver and SoC IC design, announced a partnership to provide voltage matrix multi-touch single-chip solutions. ....http://wirelessdesignasia.com/article-11032-stantumandsitronixteamtomeetdemandforcosteffectivehighperformancemultitouchinconsumerandmobileapplic-Asia.htmlTue, 30 Jun 2009 00:00:00 +0800http://wirelessdesignasia.com/article-10965-coactivekdmssub200mthicklightguidefoilsuniformlyilluminatekeypadsonmobilephoneshandheldelectronicdev-Asia.htmlCoActive Technologies KDM has expanded its family of light guide foils to include devices with a thickness of less than 200µm. The light guide foils are designed to evenly distribute light from side-firing ....http://wirelessdesignasia.com/article-10965-coactivekdmssub200mthicklightguidefoilsuniformlyilluminatekeypadsonmobilephoneshandheldelectronicdev-Asia.htmlWed, 24 Jun 2009 00:00:00 +0800http://wirelessdesignasia.com/article-10841-ims2009tohighlightlatestrfmicrowavetechnologiesapplicationsandtrends-Asia.htmlBy Stephen Las Marias, Editor In an email interview, Fred Schindler, Chairman, IMS 2009, and Director, RF Micro Devices Boston Design Center, discusses with Wireless Design and Development Asia some of ....http://wirelessdesignasia.com/article-10841-ims2009tohighlightlatestrfmicrowavetechnologiesapplicationsandtrends-Asia.htmlWed, 3 Jun 2009 00:00:00 +0800http://wirelessdesignasia.com/article-10828-stantumgrantedkeypatentsonitsmultitouchtechnology-Asia.htmlStantum, a developer of multi-touch solutions and systems since 2002, announced today that both the European Patent Office and the China Patent & Trademark Office have granted patents (EP1719047 and CN100447723C, ....http://wirelessdesignasia.com/article-10828-stantumgrantedkeypatentsonitsmultitouchtechnology-Asia.htmlWed, 3 Jun 2009 00:00:00 +0800