Click to navigate back to homepage  
Sunday, July 5, 2009 
  Search :



 
 
     
 
 
Business News & Technology News > Mar 2007
 
 

Ultra Mobile Broadband Seminar at CTIA Wireless 2007

(Business News & Technology News, 21 Mar 2007)


Leading wireless industry companies will be presenting a Special Interest Seminar to provide an in-depth overview of Ultra Mobile Broadband (UMB) during CTIA Wireless 2007, March 27-29 in Orlando. The seminar will introduce UMB technology, including its technical advantages and commercial opportunities, and the multimedia services it will enable. Among the comapnies that will be discussing the delivery of next-generation mobile broadband services are Alcatel-Lucent, CDG, Deutsche Bank Securities, Hitachi, Huawei Technologies, LG Electronics, Motorola, Nortel, QUALCOMM, and ZTE.

Presentation topics will include:
- Mobile Broadband Introduction
- Technology Overview and Timelines
- UMB Deployment Options
- UMB Technology Features
- Devices for UMB
- UMB Performance
- Applications and Services on the Road to UMB
- UMB Next-Generation Network
- UMB Services and Applications

This UMB seminar is hosted by the CDG, moderated by CDG COO James Person, and will include presentations from the following leading wireless industry companies:

- Mike Hobby, Director, CDMA Marketing, Alcatel-Lucent
- Brian Modoff, Managing Director, Senior Wireless Equipment Analyst, Deutsche Bank Securities
- Toshiro Suzuki, Senior Vice President, Mobile System Development, Hitachi
- Jane Wan, Director, Marketing, Huawei
- Dr. In-Kyung Kim, Vice President, R&D, LGE
- Pepe Lastres , Director, Marketing, Motorola
- Anit Lohtia, Director, Next Generation Air Interface Technologies, Nortel
- Eduardo Esteves, Senior Director, Technical Marketing, QUALCOMM
- Donglin Shen, Vice President, Wireless Technology, ZTE

To attend the seminar, one must be a registered participant of CTIA Wireless 2007.

Click here for more information

 
 
 
 
Related Articles
   

Asia-Pacific Drives Global Mobile Revenue Growth

AT&T to Offer BlueAnt Q1 Bluetooth Headset

Alcatel-Lucent Launches “World's First” Green DSL

Synopsys MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform

Cellular South Sponsors Netbook Design Challenge Contest

Inmarsat FleetBroadBand 150 Goes Live

Femtocell Equipment Manufacturers Can Quickly Develop Residential and Enterprise Products with TI’s Femtocell DSP Family

New ZigBee Green Power Feature Set Revealed

Jitter Transceivers from National Semiconductor Deliver 30 Percent More Backplane and Cable Reach

Yageo Announces 1044 SMD LP Patch Antenna Targeting GPS Application for Smart Phones

   
 
Product News
   

STMicroelectronics Innovates Integrated Protection ICs, Enabling Smaller, Sleeker PoE

Femtocell Equipment Manufacturers Can Quickly Develop Residential and Enterprise Products with TI’s Femtocell DSP Family

Alcatel-Lucent Launches “World's First” Green DSL

AT&T to Offer BlueAnt Q1 Bluetooth Headset

Aeroflex Expands its Flexible, Modular PXI Platform With High-Power Signal Generators for RF Component Test

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 


 
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.