Click to navigate back to homepage  
Saturday, March 20, 2010 
  Search :



 
 
     
 
 
Business News & Technology News > Mar 2007
 
 

Ultra Mobile Broadband Seminar at CTIA Wireless 2007

(Business News & Technology News, 21 Mar 2007)


Leading wireless industry companies will be presenting a Special Interest Seminar to provide an in-depth overview of Ultra Mobile Broadband (UMB) during CTIA Wireless 2007, March 27-29 in Orlando. The seminar will introduce UMB technology, including its technical advantages and commercial opportunities, and the multimedia services it will enable. Among the comapnies that will be discussing the delivery of next-generation mobile broadband services are Alcatel-Lucent, CDG, Deutsche Bank Securities, Hitachi, Huawei Technologies, LG Electronics, Motorola, Nortel, QUALCOMM, and ZTE.

Presentation topics will include:
- Mobile Broadband Introduction
- Technology Overview and Timelines
- UMB Deployment Options
- UMB Technology Features
- Devices for UMB
- UMB Performance
- Applications and Services on the Road to UMB
- UMB Next-Generation Network
- UMB Services and Applications

This UMB seminar is hosted by the CDG, moderated by CDG COO James Person, and will include presentations from the following leading wireless industry companies:

- Mike Hobby, Director, CDMA Marketing, Alcatel-Lucent
- Brian Modoff, Managing Director, Senior Wireless Equipment Analyst, Deutsche Bank Securities
- Toshiro Suzuki, Senior Vice President, Mobile System Development, Hitachi
- Jane Wan, Director, Marketing, Huawei
- Dr. In-Kyung Kim, Vice President, R&D, LGE
- Pepe Lastres , Director, Marketing, Motorola
- Anit Lohtia, Director, Next Generation Air Interface Technologies, Nortel
- Eduardo Esteves, Senior Director, Technical Marketing, QUALCOMM
- Donglin Shen, Vice President, Wireless Technology, ZTE

To attend the seminar, one must be a registered participant of CTIA Wireless 2007.

Click here for more information

 
 
 
 
Related Articles
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

MobGold Raises $12M Led by Fast Global Investments in Series B Financing

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

Anritsu Intros First Bluetooth Low Energy Test Solution

LSI Samples 6Gbps SAS RAID-on-Chip IC for Next-gen PCI Express 3.0 Server Platforms

STMicroelectronics Receives EuroDOCSIS 2.0 Certification for Set-top Box Reference Design

Intel Atom Integrates Graphics, Memory Controller for Netbooks

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.